Report Highlights
As the semiconductor industry slid into a downturn, in 2008 China's semiconductor assembly market slowed down compared with 2007. To present an accurate picture of the present situation and development trend of China's semiconductor assembly market, we release the 2008-2009 Annual Report on China's Semiconductor Assembly Industry, which will help vendors, investors, industry insiders grasp the law governing the development of China's semiconductor assembly industry.
* In-depth and accurate market research data: On the basis of in-depth research in the industry, the report provides data on product structure, packaging structure and application structure, and identifies the market's development direction.
* All-round and in-depth brand competition analysis: we examine vendors in the dimension of market pattern, competitive strategy and SWOT analysis, and reviews the makings of market leaders.
* More scientific and complete forecasts: Through modeling regression and expert verification in major market segments, the report examines related links in the industry, and presents valuable trend analysis and quantitative forecast result.
The report takes a look at the development of China's semiconductor assembly market in 2008, analyzes the drivers and characteristics of the market, and conducts objective and comprehensive assessment of leading vendors. Meanwhile, through mass surveys and accurate data, it offers complete information on China's semiconductor assembly market, to provide effective decision support for enterprises. The report mainly covers the following.
* The current size and characteristics of China's semiconductor assembly market
* The semiconductor assembly market divided by packaging form
* The semiconductor assembly market divided by application fields
* Analysis of leading vendors
* Forecast of market segments
